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- W2366703162 abstract "The tensile fracture behavior and the intermetallic compound’s(IMC’s) morphology and composition at the interface of Cu/Sn-3.0Ag-0.5Cu/Cu solder joint specimens after aging at(150±1)℃ for 0-1 000 h were studied.The results show that,with the increasing aging time,the tensile fracture strength of the solder joints decreases and the crack initiates mostly at the interfaces between the solder and IMC layer or/and IMC and IMC layer.The morphology of fracture surface changes from dimple-like to cleavage-like surfaces.SEM analysis indicates that the needle-like or block-like interfacial IMC forms at the interface of Cu/solder and grows into the solder matrix.After being aged for 1 000 h,the obvious IMC multilayer structure is observed,which is defined as Cu/Cu3Sn/Cu6Sn5/solder structure for the half-joints.Moreover,the Kirkendall voids can be observed in the multilayer structure close to the copper substrate.These voids are possibly one of the factors of the tensile fracture mechanism." @default.
- W2366703162 created "2016-06-24" @default.
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- W2366703162 date "2007-01-01" @default.
- W2366703162 modified "2023-09-23" @default.
- W2366703162 title "Effects of interfacial IMC on tensile fracture behavior of Sn-3.0Ag-0.5Cu solder joints on copper substrates" @default.
- W2366703162 hasPublicationYear "2007" @default.
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