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- W2367616177 abstract "With the increase of ICs speed, the power/ground voltage bounces on the power gound planes pair of the multi chip module becomes the bottleneck of the development of high speed ICs. The current study of the power/ground voltage bounces is focused on the regular planes. In this paper, the effect of the apertures on MCM's power/ground planes was analyzed, it mainly increases the voltage bounces on the power/ground planes of MCMs, this effect is evaluated by using the PEEC model of such power/ground system." @default.
- W2367616177 created "2016-06-24" @default.
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- W2367616177 date "2002-01-01" @default.
- W2367616177 modified "2023-09-26" @default.
- W2367616177 title "Analysis of the Voltage Bounce on Power/Ground Planes with Aperture and Slit" @default.
- W2367616177 hasPublicationYear "2002" @default.
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