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- W2367693265 abstract "Laser reflow bumping becomes a potential technique due to the unique characteristic of laser such as high energy input density and local heating.Research status of laser reflow on solder bump forming of area array packages are introduced,and experimental analysis on laser reflow of PBGA solder ball is performed.Results show that good quality of solder bump with smooth surface and high shear strength can be achieved under appropriate laser input energy." @default.
- W2367693265 created "2016-06-24" @default.
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- W2367693265 date "2002-01-01" @default.
- W2367693265 modified "2023-09-24" @default.
- W2367693265 title "Research Status and Application of Laser Reflow on Solder Bump Forming of Area Array Packages" @default.
- W2367693265 hasPublicationYear "2002" @default.
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