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- W2367698043 abstract "The intermetallic compounds(IMC) in three kinds of lead-free solder joints(Sn3.0Ag0.5Cu,Sn0.7Cu and Sn3.5Ag) in microelectronic packages were synthesized according to the actual process and service conditions.The morphology and chemical composition of the prepared IMC were studied with SEM and EDX,while the elastic modulus and hardness of the prepared IMC were measured at different loading rates by using the nanoindentation continuous stiffness measurement technique.The results show that the prepared IMC in three kinds of solder joints are all Cu6Sn5.Their Young’s moduli are 98.93±3.37,113.55±4.58 and(102.16±3.11) GPa,respectively,while their harnesses are 5.18±0.14,5.78±0.11,and(5.55±0.19) GPa,respectively." @default.
- W2367698043 created "2016-06-24" @default.
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- W2367698043 date "2012-01-01" @default.
- W2367698043 modified "2023-09-23" @default.
- W2367698043 title "A nanoindentation study of the mechanical properties of intermetallic compounds in lead-free solder joints" @default.
- W2367698043 hasPublicationYear "2012" @default.
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