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• W2368157159 abstract "Introduced is the fabrication of silicon base with groove and TSV(through silicon via) for wafer level packaging of white LED.Based on the structure of silicon-based high-power LEDs,the heat transfer model is established and finite element software is employed to simulate and analyze the heat dissipation of this package.Simulation results show that the silicon base packaging meets the temperature requirement of LED chip p-n junction.Combined with semiconductor manufacturing process,the fabrication of the groove and TSV was carried out on the silicon substrate,realizing effective packaging of LED chips.The thermal resistance of silicon substrate measured by T3Ster is 1.068 K/W.Experimental results show that this method is effective for realizing LED chip packaging with low cost,low thermal resistance and high density." @default.
• W2368157159 created "2016-06-24" @default.
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• W2368157159 date "2013-01-01" @default.
• W2368157159 modified "2023-09-25" @default.
• W2368157159 title "Package Technology of Silicon-based High-power LEDs with TSV" @default.
• W2368157159 hasPublicationYear "2013" @default.
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