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- W2368167029 abstract "The effects of thermomechanical treatments including solid solution,hot rolling and aging on microstructure and properties of Cu-1.5Ni-0.34Si alloy were studied.The micro-hardness and electrical conductivity of Cu-1.5Ni-0.34Si alloy under different thermomechanical treatment conditions were measured,and the microstructure of alloy was examined by optical microscopy and transmission electron microscopy.The Cu-based alloy was solid solution treated at 700 ℃,800 ℃ and 900 ℃ for 1 h,respectively.The alloy solution treaded at 900 ℃ shows the larger grain size of 300 μm comparing with the grain size of 150 μm and 30 μm in solution treated at 800 ℃ and 700 ℃.The peak strength occurres in sold solution treated at 800 ℃ for 1 h followed by aging treatment at 450 ℃ for 16 h,at which point the micro-hardness is 181HV and the average precipitate diameter is 12 nm.When the aging time goes up to 500 h,the average grain diameter is 30 nm.After solid solution treated at 800 ℃ for 1 h and 40% hot rolling,then aging at 450 ℃ for 4 h,the micro-hardness and related electrical conductivity of the alloy are 186HV and 52% IACS,respectivly." @default.
- W2368167029 created "2016-06-24" @default.
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- W2368167029 date "2011-01-01" @default.
- W2368167029 modified "2023-09-23" @default.
- W2368167029 title "Effect of thermomechanical treatment on microstructure and properties of Cu-1.5Ni-0.34Si alloy" @default.
- W2368167029 hasPublicationYear "2011" @default.
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