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- W2368349547 abstract "In this paper, the history of ACF and driver IC packaging are described. In addition, it is mentioned that how important driver IC packaging is in implementing in the product for miniaturization, high resolution, low cost and high display quality. ACF material design for COF which is advantageous in fine pitch interconnection is described. It is indicated that low temperature curable ACF is very useful in improving productivity of LCD modules and reducing the thermal stress at the interface in large LCD modules. We also indicate that the warpage of LCD panel after COG interconnection induces the light linkage issue in LCD modules. Lowering bonding temperature of ACF is also very important in reducing the warpage issue and avoiding the light linkage issue when COG is applied for driver IC packaging in large LCD modules." @default.
- W2368349547 created "2016-06-24" @default.
- W2368349547 creator A5075239741 @default.
- W2368349547 date "2010-01-01" @default.
- W2368349547 modified "2023-09-24" @default.
- W2368349547 title "Driver IC Packaging Technologies using Anisotropic Conductive Films in Flat Panel Display" @default.
- W2368349547 hasPublicationYear "2010" @default.
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