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- W2368401265 abstract "A two-component addition cure LED encapsulation adhesive with high refractive index was prepared by phenyl vinyl silicone resin,phenyl vinyl silicone oil,hydrogen-containing silicone oil and tackifier,etc.The effect of the materials on the impact at both high and low temperatures was studied.The material was formulated by adding 5 to 10% of KH 560 into a phenyl vinyl silicone resin,then a mixture of phenyl vinyl silicone oil with a viscosity of 5,000 mPa·s and 300 mPa ·s respectively at a mass ratio of 10∶ 2,0.43%active hydrogen of phenyl silicone oil as the crosslinker,and 1% epoxy and hydrogen-containing prepolymer as the tackifier.Results showed that the LED encapsulant still kept working in the absence of cracks and glue off the bottom and the film when it was used for 5050 and 5730 lighthouse testing after fully cured,three times reflow soldering,and then in high-low temperature impact tester from- 40℃ to 100 ℃ after 500 times cold-hot cycles." @default.
- W2368401265 created "2016-06-24" @default.
- W2368401265 creator A5038757126 @default.
- W2368401265 date "2013-01-01" @default.
- W2368401265 modified "2023-09-24" @default.
- W2368401265 title "Study on High and Low Temperature Impact of High Refractive Index LED Encapsulation Adhesive" @default.
- W2368401265 hasPublicationYear "2013" @default.
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