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- W2368601430 abstract "Pb(Zr0.52Ti0.48)O3 (PZT) ferroelectric thin films were grown on Ti buffered Pt(111) thin film bottom electrode by RF magnetron sputtering method at low substrate temperature (370 ℃), followed by a rapid thermal annealing (RTA) process with temperature ranged from 580 ℃ to 680 ℃ in air ambient for 5 minutes. Scanning electrom microscopy(SEM) and X-ray diffraction(XRD) measurements showed that Pb(Zr0.52Ti0.48)O3 films annealed above 580 ℃ are polycrystalline with pure perovskite phase and grain sizes about 15 nm, the preferred orientation for the samples annealed below and above 600 ℃ are (110) and (111), respectively. Ferroelectric and dielectric properties of Pt/PZT/Pt capacitors were carried out by RT66A standardized ferroelectric test system. It was observed that the polarization of PZT films is increasing as the annealing temperature increasing, and, due to the interdiffusion at high temperature, the leakage current is dramatically increasing while the annealing temperature over 650 ℃." @default.
- W2368601430 created "2016-06-24" @default.
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- W2368601430 date "2003-01-01" @default.
- W2368601430 modified "2023-09-25" @default.
- W2368601430 title "EFFECTS OF POST-ANNEALING TEMPERATURE ON THE STRUCTURE AND PROPERTIES OF Pb(Zr_(0.52)Ti_(0.48)O_3 FERROELECTRIC THIN FILMS PREPARED BY RF SPUTTERING" @default.
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