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- W2369305720 abstract "The Ni-Cu-P coating was prepared on cemented carbide substrate by electroless plating.The influence of deposition parameters such as bath composition,pH and temperature on the plating rate and properties of the Ni-Cu-P coating was studied.The plating rate was measured by weighing the sample.The bond strength of the Ni-Cu-P coating with hard metal substrate was investigated by scratch test.Surface and interface morphologies of coating were characterized by scanning electron microscopy(SEM).The results show that the optimum plating parameters are the concentration of CuSO4.5H2 O 1.25 g /L,the pH value 11 and the plating temperature 90 ℃,the plating rate reaches 0.61 g /(m2·min).The Ni-Cu-P coating is uniform,and the main components are Ni and Cu,good metallurgical bonding between the Ni-Cu-P layer,the substrate material and the tin solder can be obtained." @default.
- W2369305720 created "2016-06-24" @default.
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- W2369305720 date "2010-01-01" @default.
- W2369305720 modified "2023-09-27" @default.
- W2369305720 title "Research on technology and performance of electroless Ni-Cu-P plating on cemented carbide" @default.
- W2369305720 hasPublicationYear "2010" @default.
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