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- W2370061280 abstract "A mechanical test(drop test) of reliability for Lead-free BGA assembly was introduced to evaluate the reliability of BGA assembly under the mechanical shock and thermal stress.And further research on the microstructure and composition of soldering joints in failed BGA assemblies was carried out to find out the major cause undermining the reliability.The test result showed the failure mechanism was complicated and the failure of the soldering interface was related to the IMC fracture behavior in most cases.The characteristic of intermetallic compound(IMC) at interface was also studied." @default.
- W2370061280 created "2016-06-24" @default.
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- W2370061280 date "2006-01-01" @default.
- W2370061280 modified "2023-09-26" @default.
- W2370061280 title "Mechanical Test on Reliability of Lead-free BGA Assembly and Microstructure Analysis of Soldering Interface" @default.
- W2370061280 hasPublicationYear "2006" @default.
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