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- W2370298218 abstract "The texture gradient in hot rolled grain oriented silicon steel strip is one of the essential factors to achieve a perfect secondary recrystallization.The addition of copper can significantly reduce the slab reheating temperature of grain oriented silicon steel,so as to impact the texture distribution in the hot rolled strip.The texture of hot rolled grain oriented silicon steel strip as-rolled by thin slab casting and rolling process(TSCR) in laboratory with three different copper contents was analyzed by using X-ray diffraction tester.The results show that the main texture from the surface to 1/4 thickness in the hot rolled strip of different copper contents is the weak hot rolling texture,and the main texture in the center is {100} texture.When the copper content is about 0.4%,the fraction of {110}001 texture in the near surface layer of hot rolled strip is highest,while the fraction of {100}110 texture in the center of hot rolled strip is lowest.The copper content may significantly influence the development of {114}110 and {001}100 textures in hot rolled grain oriented silicon steel strip." @default.
- W2370298218 created "2016-06-24" @default.
- W2370298218 creator A5065293431 @default.
- W2370298218 date "2011-01-01" @default.
- W2370298218 modified "2023-09-23" @default.
- W2370298218 title "Effect of Cu Content on Hot Rolling Texture of Grain Oriented Silicon Steel Produced by TSCR" @default.
- W2370298218 hasPublicationYear "2011" @default.
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