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- W2372393362 abstract "The microelectromechanical system(MEMS) packaging technology is a key technique for MEMS based on microelectronics packaging.Function,some particularities and classification of MEMS packaging technologies are put forward,some important and advanced technologies of MEMS packaging are introduced,such as bonding technology,top bottom ball grid array technology(TB-BGA),flip-chip technology(FCT),multi-chip packaging(MCP) technology and three dimensions(3-D) technology.Finally,the trends of development and research for MEMS packaging are discussed." @default.
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- W2372393362 date "2006-01-01" @default.
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- W2372393362 title "MEMS packaging technology" @default.
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