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- W2372471192 abstract "Under effects of temperature field,acceleration load and their coupling,deflection and stress of semiconductor silicon-based composite film cantilever will change. When the equipment is under heating condition,the temperature of itself will rise as well as thermal stress and strain will be generated. Due to the differences between expansion coefficients of films,small expansion coefficient of film is experienced pulling force,however,big one is experienced pressure force. Finally,the freedom of the cantilever will bend to the direction of the small linear expansion coefficient film,causing the deflection of the bended cantilever changes. when the bended cantilever in the effection of accelerations in Z aix direction,the deflection of the bended cantilever will also be changed. By ABAQUS simulation,the value of the displacement about bended cantilever in different physical fields are given. The conclusion provides a theoretical basis for the appliance of the device which used semiconductor silicon cantilever bending composite films." @default.
- W2372471192 created "2016-06-24" @default.
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- W2372471192 date "2015-01-01" @default.
- W2372471192 modified "2023-09-28" @default.
- W2372471192 title "Finite element analysis of thermal structure composite film based on ABAQUS" @default.
- W2372471192 hasPublicationYear "2015" @default.
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