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- W2372604401 abstract "Structure designing and key processing technologies for wafer level package(WLP) were studied.The selection of under bump metal(UBM),the reflow and quality control of bumping are described.And techniques to make lead-free solder bumping with electroplating are illustrated." @default.
- W2372604401 created "2016-06-24" @default.
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- W2372604401 date "2005-01-01" @default.
- W2372604401 modified "2023-10-02" @default.
- W2372604401 title "Lead-Free Solder Bumping Technology for Wafer Level Package" @default.
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