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- W2373135310 abstract "A high-temperature adhesive was prepared with silicone resin as a matrix,metal Al,B4 C and fumed SiO2 powders as inorganic fillers.The phase compositions,microstructures and thermal stability of the adhesive were analyzed by X-ray diffraction,scanning electron microscopy,energy dispersive spectrometry and thermogravimetry,respectively.The bonding performance of the adhesive for ceramic joints was characterized through the compressive shear strength test.The results indicate that the mass of the adhesive increases 38%after heat treatment at 1 150℃.The bonding strength of ceramic joints is 9.00MPa after cured at 200℃,and increases to be 45.60MPa at 1 000℃.According to the mechanism analysis,the bonding strength is derived from organic silicone resin in the adhesive at600℃,and metal Al and B4 C powders should be oxidized and then reacted with pyrolysis products of silicone resin to produce the ceramic/glass phases like xSiOm Cn ·yB2 O3,2Al2 O3 ·B2 O3 and 9Al2 O3 ·2B2 O3 at600℃.The volume expansion caused by the oxidation of inorganic fillers can effectively inhibit the volume shrinkage by the pyrolysis of organic silicone resin at elevated temperatures and heal the micro-defects.In addition,chemical bonds are introduced into the bonding interfaces through the formation of element mutual diffusion layer,further improving the bonding strength at elevated temperatures." @default.
- W2373135310 created "2016-06-24" @default.
- W2373135310 creator A5021371311 @default.
- W2373135310 date "2014-01-01" @default.
- W2373135310 modified "2023-09-26" @default.
- W2373135310 title "High Temperature Bonding Performance and Mechanism of Silicone Adhesive Modified by Inorganic Fillers" @default.
- W2373135310 hasPublicationYear "2014" @default.
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