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- W2373932407 abstract "A novel 60Si40Al alloy packaging material for electronic applications was prepared by spray forming technology. The effect of parameter upon performs, the microstructures produced from spray forming process, and the hot isostatic pressing(HIP) process were studied. The results show that Si phase is fine and dispersion, the microstructure of performs from spray forming is fine and uniform, the thermal expansivity(CTE) is about 9×10~(-6)～10×10~(-6)/K, and the thermal conductivity is about 110W/(m·K)." @default.
- W2373932407 created "2016-06-24" @default.
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- W2373932407 date "2004-01-01" @default.
- W2373932407 modified "2023-09-25" @default.
- W2373932407 title "Novel 60Si40Al alloy packaging material by spray forming process" @default.
- W2373932407 hasPublicationYear "2004" @default.
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