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- W2374069654 abstract "Icepak-based thermal analysis software is adopted for optimized design of radiator of certain electronic equipment to determine the optimum size of the radiator. In addition,simulated fan flow is used to estimate the actual fan flow of cabinet;proper fan is selected for thermal analysis of cabinet;and heat-sinking capacity of optimized radiator is verified." @default.
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- W2374069654 date "2012-01-01" @default.
- W2374069654 modified "2023-09-24" @default.
- W2374069654 title "Icepak-based Thermal Analysis and Improvement in Electronic Equipment" @default.
- W2374069654 hasPublicationYear "2012" @default.
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