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- W2374301926 abstract "A novel metallization proceeding on CVD diamond substrates for heat sink is reported. The good adhesion strength between metal layers and diamond substrates can be obtained by pre fire and post treatment processing using electron beam evaporation techniques and Ti/Ni/Au metallization system. The results show that the adhesion strength can be significantly improved from un pretreatments 14 0MPa to 48 9MPa by the pre fire of the bare diamond substrates. The system diamond /Ti /Ni /Au indicates excellent adhesion after thermal cycling 100 times between 203K and 423K and there are no signs of delamination. Further, XRD confirms that the Ti layer reacts with the diamond substrates to form TiC and TiO species on the interface during post deposition annealing 673K×2h in vacuum. The interface diffusion or reaction of Ti/diamond depend on not only the temperature but also the surface conditions of the diamond." @default.
- W2374301926 created "2016-06-24" @default.
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- W2374301926 date "2003-01-01" @default.
- W2374301926 modified "2023-09-25" @default.
- W2374301926 title "Metallization on CVD Diamond Substrates for Thermal Management" @default.
- W2374301926 hasPublicationYear "2003" @default.
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