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- W2374724809 abstract "To research the microstructural characterization of diffusion-bonded new Ni-Cr-W alloy interfaces,taking Cu,Ni,Cu/Ni/Cu foil as interlayer or without interlayer,the vacuum solid-state diffusion bonding processes were successfully carried out to join Ni-Cr-W alloy at 950 ℃,30 MPa,45 min.The influences of different interlayer on the microstructure and elements concentration distribution of new Ni-based alloy across the interface were investigated in details.Results show that several pores and M23C6 particles could be found in the joint of direct diffusion bonding.These defects and precipitates slowed down the diffusion of elements,leading to poor bonding quality.Using Cu foil interlayer,a reaction layers with thickness of 1.3 μm was formed between the Cu and Ni-Cr-W alloy.However,a sound bounding was obtained without any reaction layer when the Ni was used as interlayer.When used Cu/Ni/Cu multilayers,reaction layer and solution layer(thickness is about 9 μm) could be found in Ni-Cr-W/Cu and Ni/Cu interface,respectively.Further investigation indicates that the existence of M23C6 blocked the diffusion of Cu atoms across the diffusion interface." @default.
- W2374724809 created "2016-06-24" @default.
- W2374724809 creator A5084845056 @default.
- W2374724809 date "2013-01-01" @default.
- W2374724809 modified "2023-09-26" @default.
- W2374724809 title "Influence of interlayer on interfacial microstructure of diffusion bonded Ni-Cr-W superalloy" @default.
- W2374724809 hasPublicationYear "2013" @default.
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