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- W2375348531 abstract "The atoms diffusion and growth behavior of intermetallic compound(IMC) at Sn3.5Ag0.5Cu/Ni interface after thermal-shearing cycling (25-125 ℃) were investigated,which was compared to compound growth behavior under isothermal aging condition.The results showed that there is a type of(CuxNi1-x)6Sn5 IMC formed at the interface after reflowing,and the morphology of compound changes from scallop-like with the cycling increasing.There is another kind of compound(NixCu1-x)Sn3 formed surrounding(CuxNi1-x)6Sn5 after 200 cycles and grow up rapidly as planarlike.As the thermal-shearing cycling increasing,Ag3Sn formed uniform particles after reflowing congregates to grow up to chunk-like in the solder.The IMC at the interface growth follows a parabolic growth kinetiscs with the thermal-shearing cycling increasing,implying that it was controlled by Cu atom diffusion." @default.
- W2375348531 created "2016-06-24" @default.
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- W2375348531 date "2007-01-01" @default.
- W2375348531 modified "2023-09-24" @default.
- W2375348531 title "Growth behavior of compounds at Sn3.5Ag0.5Cu/Ni under thermal-shearing cycling" @default.
- W2375348531 hasPublicationYear "2007" @default.
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