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- W2376675527 abstract "Based on Moldflow and UDE method, a cooling+flowing+warpage simulation analysis was made on a printer cover in which the amount of warpage was set as the ex perimental index, the mould temperature, melt temperature, packing pressure, packing time and injection time as design variables, the regression equation of warpage was established to optimize the processing parameters. The experiments show that through multilevel UDE method, the number of experiments can be effectively reduced and the optimal combina tion of process parameters was obtained. It also concludes that every design variable has certain influence on the experimental indexes, and the importance of factors was se quenced according to the regression analysis by SPSS19.0 statistical software." @default.
- W2376675527 created "2016-06-24" @default.
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- W2376675527 date "2013-01-01" @default.
- W2376675527 modified "2023-09-27" @default.
- W2376675527 title "Optimization of process parameters to decrease the warpage of printer cover based on Moldflow and UDE" @default.
- W2376675527 hasPublicationYear "2013" @default.
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