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- W2377152008 abstract "A method is proposed to estimate the thickness limit for single layer microbridge testing.To evaluation the mechanical properties of the Cu film which could not be measured by single layer microbridge testing,the NiFe single layer film and Cu/NiFe/Cu trilayer film microbridge is fabricated by MEMS technique and microbridge testings are then conducted,respectively.From the single layer microbridge theory,the elasticity modulus and residual stress of the NiFe film is deduced.Then the data is introduced into the trilayer microbridge theory and the Young's modulus and residual stress of the copper film is also obtained." @default.
- W2377152008 created "2016-06-24" @default.
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- W2377152008 date "2008-01-01" @default.
- W2377152008 modified "2023-09-23" @default.
- W2377152008 title "Mechanical properties of metal thin film characterized by trilayer microbridge testings" @default.
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