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- W2377441309 abstract "Miniaturization of electronic/ mechanical systems is achieved by packing different functional components into tight geometrically complex heat transfer paths. This paper proposes a concept that aims at reduction of analysis load on the packaging designer. The ways are used to generate possible geometric configurations of heat transfer paths in a systematic manner and the heat spreading on the planar substrate as an example. The temperature solutions for these configurations are compressed into fast estimate formulas that free the packaging designer from the need to perform involved. The results show that the miniaturization of system for the thermal design is the coupling between the system configuration and the overall heat dissipation to the environment. A model situation is considered where heat diffuses from a zone on the system shell and to the environment by natural convection andradiation. Therefore,the conclusion is made that in the parametric domain spanned by the thermal conductivity of shell material and the system's characteristic length there is a zone where the system-level heat transfer is sensitive to the system's configuration. Such characteristic length is around1 cm for systems encapsulated in plastics,3-10 cm for those in ceramic and alloy shells,and 10-40 cm in copper or aluminum clad systems." @default.
- W2377441309 created "2016-06-24" @default.
- W2377441309 creator A5016624554 @default.
- W2377441309 date "2015-01-01" @default.
- W2377441309 modified "2023-09-28" @default.
- W2377441309 title "Inquiry for Thermal Issues in Microsystems Packaging" @default.
- W2377441309 hasPublicationYear "2015" @default.
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