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- W2377680650 abstract "A new connection technology between COB heat dissipation substrate and fins was introduced, namely soldering join technology. Compared with traditional thermal glue connection technology, the influence of soldering join technology on thermal dissipation performance of LED was studied by the experiment and thermal simulation. The experimental results show that the temperature difference of packaging structure with soldering join is 3 ℃ and the temperature difference of packaging with thermal glue join is 4.5 ℃. At the heat load of 60 ℃, the same result is obtained by thermal simulation whose temperature differences of soldering joining and thermal glue joining are 0.8 ℃ and 1.6 ℃, respectively. When the heat load increases, the temperature difference of packaging structure with soldering join increases more slowly. The thermal dissipation performance of high power LED would be highly improved by the soldering join technology." @default.
- W2377680650 created "2016-06-24" @default.
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- W2377680650 date "2014-01-01" @default.
- W2377680650 modified "2023-09-23" @default.
- W2377680650 title "Influence of ceramic substrate and soldering join technology on thermal dissipation performance of LED" @default.
- W2377680650 hasPublicationYear "2014" @default.
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