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- W2378492041 abstract "The effects of Ni on the microstructure and mechanical properties of Sn2.5Ag0.7Cu0.1RE solder and solder joints were studied by using the scanning electronic microscope and X-ray diffraction.The results show that adding proper amount of Ni in Sn2.5Ag0.7Cu0.1RE solder alloys can refine the initial β-Sn phase and eutectic structure,suppress the growth of the(Cu,Ni)6Sn5 intermetallic compound(IMC) at the interface of solder joints,and reduce the roughness of interfacial IMC,improve the shear strength of the SnAgCuRE/Cu solder joints.The solder alloy structure was fine and homogenous,eutectic structure proportion was large,interfacial IMC was thin and flat and the grain size of(Cu,Ni)6Sn5 was small.The shear strength got the maximum value(45.6 MPa) when the Ni content was 0.1 wt%,which was 15.2% higher than the solder joints without Ni." @default.
- W2378492041 created "2016-06-24" @default.
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- W2378492041 date "2012-01-01" @default.
- W2378492041 modified "2023-09-25" @default.
- W2378492041 title "Effect of Ni on interfacial IMC and mechanical properties of Sn2.5Ag0.7Cu0.1RE/Cu solder joints" @default.
- W2378492041 hasPublicationYear "2012" @default.
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