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- W2378614648 abstract "Height information is the most important parameter in analysing an object′s three-dimensional morphology.In order to study the three-dimensional topography of small solder joints,the height of solder joints needs to be measured.In overcoming the shortcomings of traditional measurement techniques,a new detection system was designed.The system applies white parallel light exposure stripes board,projects its image onto the tested object.With the modulation of the object height profile,a distorted bright-dark stripe was formed.Whose fringe pattern carried the three-dimensional information of the solder joints and the distorted fringes were then shot on to the CCD by the camera system.Through processing the CCD image,the height information could be restored.Uniformly-spaced images of the striped panels projected onto the measured object surface were realized by this method,the image processing errors caused by the projection stripes of different widths were avoided.The advantages of the system include large measurement range,good reproducibility,simple image processing,etc.providing a new way for small height measurement." @default.
- W2378614648 created "2016-06-24" @default.
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- W2378614648 date "2012-01-01" @default.
- W2378614648 modified "2023-09-23" @default.
- W2378614648 title "Design of projection optical system of the solder joint height detection device" @default.
- W2378614648 hasPublicationYear "2012" @default.
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