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- W2378788455 abstract "To promote the application of chilled ceiling technology,a chilled ceiling panel using encapsulated Phase Change Material(PCM) is developed,and its thermal performance and heat transfer mechanism is analyzed.Mathematic model is built for the cool room and simulation is made to evaluate the thermal performance.Thermal contact resistance and conduction shape factor are taken into consider-ation especially.Existence of air gap between PCM and aluminum plate largely decreases the heat con-duction coefficient,which has large influence on the stable temperature and time.Heat load of conduc-tion shape factor constitutes major part of total heat load.When the cool room structure is determined,re-frigerant temperature,environmental temperature and air velocity have influence on performance of PCM ceiling,but their influence degrees are different,according to the single factor influence analysis and or-thogonal analysis for multi-factor influence.Compared with experiment results,the simulation gives the high accuracy for the trend judgement of PCM ceiling thermal performance." @default.
- W2378788455 created "2016-06-24" @default.
- W2378788455 creator A5073506303 @default.
- W2378788455 date "2010-01-01" @default.
- W2378788455 modified "2023-09-26" @default.
- W2378788455 title "Simulation on the thermal performance of chilled ceiling panel using encapsulated Phase Change Material" @default.
- W2378788455 hasPublicationYear "2010" @default.
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