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- W2379478378 abstract "The influences of additives concentrations on Cu coating quality,performance of bath were investigated using hull cell method,electrochemical technique,SEM and XRD,et al.It was found that the bright areas and throwing power of bath increase firstly and decrease afterwards with the increase of additive concentration of BSP,PPNI,ABSS and PN,and its concentrations is 24 mg/L,20 mg/L,0.02 mL/L and 20 mg/L,respectively.A bright and glossy coating is obtained after plating for 15 min under appropriate conditions.The bright area of coating is 0.6~9.8 cm,which accords to the current density region of 0~13.38 A/dm2.The throwing power of bath reaches 95.1 % and the ability of deep plating L/φ reaches 5.The current efficiency is almost 100 % under the current density region of 1~4 A/dm2.The cathodic peak current of copper electrodepositing decreases from 43 to 37 mA/cm2 and the peak potential shifts negatively by 80 mV under the function of mixed additives.The crystal of coating is superfine and mainly assigned to the(111) crystal face.The process can be used for PCB copper plating production due to the wide range of current density and temperature." @default.
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- W2379478378 date "2011-01-01" @default.
- W2379478378 modified "2023-09-25" @default.
- W2379478378 title "Influences of Additives on Coating Quality and Bath Performance in Acid Copper Plating of PCB" @default.
- W2379478378 hasPublicationYear "2011" @default.
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