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- W2379553640 abstract "Based on the drive features of RTWUSM,parts of the driving circuit will be integrated by MCM.Ansys has been used for thermal simulation of the integrated circuit units in the different convection situation.The temperature distribution and radiating of the units have been calculated.The results show that the highest junction temperature of the chips in the device under forced air convection is lower than that under natural air convection,and the heat elimination of the chips is better.The results provide the theoretical basis for the integrate design of the drive and control circuits of RTWUSM." @default.
- W2379553640 created "2016-06-24" @default.
- W2379553640 creator A5018173821 @default.
- W2379553640 date "2012-01-01" @default.
- W2379553640 modified "2023-09-26" @default.
- W2379553640 title "Thermal Simulation for Driving Unit of USM Based on Ansys" @default.
- W2379553640 hasPublicationYear "2012" @default.
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