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- W2380372263 abstract "BGA(Ball Grid Array)is a high-density encapsulation technology being widely used.Most of the defects appear at ball attachment process to BGA production process.In this paper,the DMAIC process of Six Sigma method is used to control the glue thickness and ball offset which are the two key factors to affect the ball attachment success.The equipment ability affecting the ball attachment process in BGA prodhction process is improved.Good results are obtained." @default.
- W2380372263 created "2016-06-24" @default.
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- W2380372263 date "2008-01-01" @default.
- W2380372263 modified "2023-09-25" @default.
- W2380372263 title "Application of Six Sigma Method on BGA Product Quality Improvement in F Semiconductor Company" @default.
- W2380372263 hasPublicationYear "2008" @default.
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