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- W2381332015 abstract "Laser reflow is a potential technique in bumping of SnPb eutecti c solder in electronic packaging area.Scanning Electron Microscopy(SEM)was used to analyze the interfacial reaction between63Sn37Pb and Au/Ni /Cu pad durin g laser reflow.In addition,the kinetics of Au layer dissolution and diffusion into the solder during laser heating was modeled numerically to elucidate the fo rmation mechanism of intermetallic phase at the solder/Au pad interface.Results showed that the63Sn37Pb solder reacted with the Au layer in Au/Ni /Cu pad t o form Au-Sn intermetallics soon after the solder was melted by the laser,and the morphology and distri-bution of intermetallic compounds at interface was st rongly influenced by laser input energy.With the increase of laser input ener gy,the Au-Sn intermetallics changed from the continuous layer into needle-lik e particles.Finally,AuSn 4 disappeared at the interface,distributing evenly inside the solder as small particles." @default.
- W2381332015 created "2016-06-24" @default.
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- W2381332015 date "2002-01-01" @default.
- W2381332015 modified "2023-09-24" @default.
- W2381332015 title "Reaction kinetics between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow" @default.
- W2381332015 hasPublicationYear "2002" @default.
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