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- W2382710318 abstract "The final performance of the product was directly affected by the printing quality of the solder paste and the microstructure of the welding spot.A suitable printing and welding process were gained through the study of the solder paste printing performance and the welding spot microstructure,thereby the final product performance and the application result were enhanced greatly.In this paper,SnAgCu alloy powder which was produced by the method of close-coupled gas atomization was used as raw materials.Different solder paste was prepared by changing the mass fraction of alloyed powder,and then the rheological properties and collapse performance of the solder paste as well as the microstructure of the welding spot were studied.The rotational rheometer and scanning electron microscopy was used to examine the rheological properties of the solder paste and the microstructure of the welding spot.The result indicated that:1) The viscosity of the solder paste increased with the improving of the alloyed powder mass fraction,but the viscosity of the solder paste decreased with the increase of angular velocity.2)When mass fraction of the paste prepared by alloyed powder is 87.5%,the paste viscosity is 256.6 Pa·s.This paste is suitable for printing.3)Solder pots after welding are round,full and bright,with a small amount of flux residue.And the IMC layer thickness is 5～10 μm,composed of Cu6Sn5." @default.
- W2382710318 created "2016-06-24" @default.
- W2382710318 creator A5030969060 @default.
- W2382710318 date "2011-01-01" @default.
- W2382710318 modified "2023-09-24" @default.
- W2382710318 title "The research of printability and microstructure of SnAgCu solder paste" @default.
- W2382710318 hasPublicationYear "2011" @default.
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