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- W2383350604 abstract "A new type of Au electroplating process employing dimethyl sulfoxide as organic solvent was established. The effects of bath composition and electroplating conditions on the deposition rate and appearance of Au coating were investigated. The optimized cyanide-free Au electroplating parameters were established. The morphology of as-plated Au coating was observed with a scanning electron microscope. Moreover, the adhesion of Au coating to substrate was determined by thermal shock test, and the corrosion resistance of Au coating was evaluated based on nitric acid corrosion test. It was found that optimum gold electroplating bath consisted of 10 g/L Au(PPh3)Cl (gold triphenylphosphine chloride) and 15 g/L NH4Cl; and the optimal electroplating parameters were suggested as a temperature of 60 ℃, a current density of 0.25 A/dm2, and an electroplating duration of 0.5～1.0 h (determined based on demand). The Au coating prepared under the optimized electroplating condition consisted of fine grains and had desired adhesion to substrate as well as good corrosion resistance." @default.
- W2383350604 created "2016-06-24" @default.
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- W2383350604 date "2013-01-01" @default.
- W2383350604 modified "2023-09-26" @default.
- W2383350604 title "Technology for Au Electroplating in Dimethyl Sulfoxide Organic Solvent" @default.
- W2383350604 hasPublicationYear "2013" @default.
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