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- W2384080225 abstract "High temperature pressure sensor has wide prospect of applications in aerospace and industrial field.Since it works at high temperature,the structure of package needs to be analyzed and optimized to reduce the thermal stress caused by the mismatch of the CTE.This article based on the thermo-mechanical equation,used ANSYS Workbench computer simulation tool to calculate the Von-Mises stress of the surface of the component,and adjusted the substrate diameter,substrate thickness and the thickness of the bonding layer,to optimize the package structure.The result shows that by using the optimized structure,the stress of sensitive element center can be reduced by 0.37% of the original,and the stability of the device is vastly improved." @default.
- W2384080225 created "2016-06-24" @default.
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- W2384080225 date "2013-01-01" @default.
- W2384080225 modified "2023-09-23" @default.
- W2384080225 title "SiC High Temperature Capacitance Pressure Sensor Package Structure Optimization" @default.
- W2384080225 hasPublicationYear "2013" @default.
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