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- W2384304417 abstract "The solderability of electronic solders and some factors that influence the solderability are discussed. The solderability depends, to a great extent, on the wettability, which is related with solid, liquid and gas interfacial tensions of the melted solders on substrates. The formula that expresses the relationship between the wetting angle () and spreading area (S) has set up by mathematical model. The solderability of the solder based on Sn-Zn-Ag was evaluate by the test method of spreading areas. The results indicated that the solderability of the solder has been improved by adding Zn." @default.
- W2384304417 created "2016-06-24" @default.
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- W2384304417 date "2003-01-01" @default.
- W2384304417 modified "2023-09-28" @default.
- W2384304417 title "The Solderability of the Solder Based on Sn-Ag-Bi" @default.
- W2384304417 hasPublicationYear "2003" @default.
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