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- W2384433276 abstract "The colloidal Pd is mainly used in metallization of printed circuit board(PCB) hole for electronic component assembling Pd in waste colloidal Pd needs to recover. This paper put forward 2 methods to break the colloid for recovery of Pd: the heating method and the oxidation method, and investigated the effect of dilution ratio(water/colloidal Pd) and pH level on the recovery of Pd by heating method and that of amount of aqua regia, reaction temperature and time on the recovery of Pd by oxidation method. The results showed that using heating method, after colloid breaking under the condition of dilution ratio=3,pH=1.3,100℃,the aqua regia was added to solve the Pd precipitates, then adjusting the pH to 9～10 with ammonia forming Pd(NH3)4Cl2, and then adjusting the pH to 1～1.5 with hydrochloric acid forming Pd(NH3)2Cl2, which was then reduced to Pd(99.92% in purity) with N2H4?H2O; the recovery rate was 98.79%; however, using oxidation method, after addition of aqua regia at 100℃ to break colloid, Pd was recovered and refined by the above process, the recovery rate was only 60.87%." @default.
- W2384433276 created "2016-06-24" @default.
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- W2384433276 date "2005-01-01" @default.
- W2384433276 modified "2023-09-26" @default.
- W2384433276 title "Study on the Recovery of Palladium from Waste Colloidal Palladium" @default.
- W2384433276 hasPublicationYear "2005" @default.
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