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- W2384537776 abstract "This article presents several typical cases of solder void in BGA, so as to investigate root cause and basic improving direction, as well as to interpret its risk, acceptability specification, inspection method, and disposal suggestion while solder void occurs." @default.
- W2384537776 created "2016-06-24" @default.
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- W2384537776 date "2013-01-01" @default.
- W2384537776 modified "2023-09-25" @default.
- W2384537776 title "Investigation for typical solder void" @default.
- W2384537776 hasPublicationYear "2013" @default.
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