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- W2384593325 abstract "A thermosyphon radiator for electronic device cooling was designed and made,and an experimental platform for cooling performance test was established.The radiator utilized water as working substance,and the structural sizes of evaporator and condenser were determined.The heat source temperature under different cooling power,inlet wind temperature and inlet wind speed was tested and compared. Results show that the new thermosyphon radiator has good heat dissipation performance and can meet the cooling requirement of higher thermal current density on electronic device.The performance platform can be used to improve the design of thermosyphon radiator.The cooling power,wind temperature and wind speed of the testing system are stable and can meet the precision of design.The work makes some basement of the further researching on cooling performance of thermosyphon radiator." @default.
- W2384593325 created "2016-06-24" @default.
- W2384593325 creator A5009298390 @default.
- W2384593325 date "2007-01-01" @default.
- W2384593325 modified "2023-09-24" @default.
- W2384593325 title "Experimental study on heat transfer characteristics of thermosyphon radiator" @default.
- W2384593325 hasPublicationYear "2007" @default.
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