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- W2384683857 abstract "The pad length,the pad width,the stencil thickness and the stand-off were selected as four control factors.By using an L_(25)(5~6) orthogonal array,the solder joints of a 0.5mm lead pitch,208-pin quad flat package(QFP) component which have 25 different process parameters' levels combinations were designed.The 3D shape prediction models and the 3D finite element analysis models of all the 25 QFP solder joints were developed.Using ANSYS performed the nonlinear finite element analysis of the QFP solder joints under thermal cycles.The thermal fatigue life of QFP solder joint was calculated using Coffin-Manson equation based on the plastic strain.Based on the calculated thermal fatigue life results,the range analysis and the variance analysis were performed.The results of study show that the best level combination of process parameters that results in the longest fatigue life is the pad length of 1.25mm,the pad width of 0.30mm,the stand-off of 0.05mm and the stencil thickness of 0.125mm.With 90% confidence the pad length has a significant effect on the reliability of QFP solder joints whereas the pad width,the stand-off and the stencil thickness have little effect on the reliability of QFP solder joints." @default.
- W2384683857 created "2016-06-24" @default.
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- W2384683857 date "2006-01-01" @default.
- W2384683857 modified "2023-09-25" @default.
- W2384683857 title "Study on the impact of process parameters on the reliability of quad flat package solder joints based on shape prediction and plastic strain calculation" @default.
- W2384683857 hasPublicationYear "2006" @default.
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