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- W2387124003 abstract "Analyze and compare the temperature characteristics between lead and lead-free solder.Put forward the key points of assembly process of BGA with lead and lead-free materials when products are faced with the lead and lead-free BGA assembled on a printed board.List the key points which should pay attention during mixed assembly through test.Emphasize the process control.Finally,the reliability test and analysis show that the reliability of mixed solder joint is good." @default.
- W2387124003 created "2016-06-24" @default.
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- W2387124003 date "2012-01-01" @default.
- W2387124003 modified "2023-09-23" @default.
- W2387124003 title "Assembly Technology of BGA with Lead and Lead-free Materials" @default.
- W2387124003 hasPublicationYear "2012" @default.
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