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- W2387718852 abstract "Ni-SiC composite plating was fabricated by CECD method where SiC particles were suspended in Ni plating solution. The effects of current density and SiC particles concentration in plating solution on SiC content in composite plating were studied. It was shown that increasing SiC content in composite plating can remarkably improve hardness of composite plating." @default.
- W2387718852 created "2016-06-24" @default.
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- W2387718852 date "2003-01-01" @default.
- W2387718852 modified "2023-09-27" @default.
- W2387718852 title "Research on Ni-SiC Composite Electroplating Process" @default.
- W2387718852 hasPublicationYear "2003" @default.
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