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- W2387929470 abstract "In order to study the microstructure, characteristics of the interfacial region and the joint strength of the soldering joint. In this paper, analytic instruments such as OM, SEM and X-ray diffraction are used to investigate and analyze the microstructure and the phase composition of the interfacial region. The results indicate that, interactive crystallization exists in part of the interfacial region by using a new developed kind of high strength soldering filler metal. Both solid solution of Cd,Sn,Zn and small amounts of fine grained compounds of Mg_2Sn,MgZn are founded. Solid solution can improve the strength and plasticity, and small amounts of fine-grained compounds can strengthen the matrix, which is beneficial to improve the joint strength. However, successive laminate of intermetallic compounds will result in embitterment and deteriorate the properties of the joint." @default.
- W2387929470 created "2016-06-24" @default.
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- W2387929470 date "2005-01-01" @default.
- W2387929470 modified "2023-09-25" @default.
- W2387929470 title "Microstructure and characteristics of soldering joint interfacial region of ZA alloy" @default.
- W2387929470 hasPublicationYear "2005" @default.
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