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- W2387948692 abstract "Cutting experiments for SiC ingots were taken through two methods: copper-coated steel wire combined with free abrasive, and diamond wire combined with mortar, respectively. Afterwards,effects to surface quality and wafer warp of as-cutted wafers by the two methods were discussed and the advantages were compared. It is confirmed that the former method leads to better surface quality as well as more time cost, which is suitable for small-scale experiments; while the later method leads to better shape parameter as well as more process efficiency, which is suitable for large-scale producing." @default.
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- W2387948692 date "2014-01-01" @default.
- W2387948692 modified "2023-09-23" @default.
- W2387948692 title "Comparison between Free Abrasive Method and Diamond Wire Method for SiC Materials Cutting" @default.
- W2387948692 hasPublicationYear "2014" @default.
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