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- W2388442509 abstract "The compressive creep behavior of Sn-8Zn-3Bi lead-free solder was investigated at the temperature range of 55～100 ℃ and compressive stresses between 9.3～18.6 MPa.The results show that the creep increases with increasing temperature and compressive stress.There is a linear logarithmic relationship between the steady creep rate and the temperature or the stretss.The stress exponent is similar at different temperatures,and the average value is 3.82;the appearance activation energy has not large difference under different stresses,and the average appearance activation energy is 80.68 kJ/mol.Materials constant A is 6.83×104.The compressive creep deformation of Sn-8Zn-3Bi is caused by the combination of dislocation gliding and climbing." @default.
- W2388442509 created "2016-06-24" @default.
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- W2388442509 date "2008-01-01" @default.
- W2388442509 modified "2023-09-24" @default.
- W2388442509 title "Investigation on the Compressive Creep Behavior of Sn-8Zn-3Bi Lead-Free Solder" @default.
- W2388442509 hasPublicationYear "2008" @default.
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