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- W2388893765 abstract "The curve of temperature that we adopt the technology of hot air reflow soldering to assembley the SMD is discussed.In order to improve the quality of soldering,the appropriate curve of soldering temperature is desingned,and the corresponding solution is proposed according to the physical property of various components." @default.
- W2388893765 created "2016-06-24" @default.
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- W2388893765 date "2003-01-01" @default.
- W2388893765 modified "2023-09-26" @default.
- W2388893765 title "Discuss and Analyze the Curve of SMD Soldering Temperature" @default.
- W2388893765 hasPublicationYear "2003" @default.
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