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- W2389232821 abstract "Secondary electroless copper plating system of triethanolamine (TEA) and EDTA·2Na dual-chelating-agent is researched in the paper. The test results indicate that plating rate increases with the increase of concentration of TEA ,CuSO_4·5H_2O,HCHO and pH and bath temperature,and decreases with the increase of concentration of EDTA·2Na. The additives′ influence of K_4 Fe(CN)_6 ·3H_2O,2-MBT and α,α′-dipyridyl on plating rate is great but surface quality of copper film improves when concentration of that is low. Although the influence of PEG-1000 on plating rate is little,the influence of that on deposits quality especially copper surface is great. The optimal conditions of this electroless copper plating process are that TEA is 21.5 g/L ,EDTA·2Na is 6 g/L ,HCHO is 16 ml/L,CuSO_4·5H_2O is 16 g/L,K_4 Fe(CN)_6 ·3H_2O is 100 mg/L,α,α′-dipyridyl is 20 mg/L,PEG-1000 is 1 g/L,2-MBT is 0.5 mg/L,pH is 12.75,and bath temperature is 50 ℃. Plating rate reaches 10.57 μm/h plating for 30 min in the bath. The SEM test demonstrates that the surface of copper film is smooth and grain is fine." @default.
- W2389232821 created "2016-06-24" @default.
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- W2389232821 date "2006-01-01" @default.
- W2389232821 modified "2023-09-25" @default.
- W2389232821 title "Study on Electroless Copper Plating Technology of High Plating Rate in Triethanolamine and EDTA·2Na Dual-chelating-agent System" @default.
- W2389232821 hasPublicationYear "2006" @default.
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