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- W2389318120 abstract "Basing on the characteristics of the Bulk Silicon MEMS fabrication technology, the process flow for the suspended Micro-structure is obtained. Moreover, the etching technology of silicon trench and ICP etching technology as well as their influencing factors are researched. A series of Parameters are fixed, including the type, the concentration and the temperature of the etching solution, the power and the gas-flow of the ICP etching technology. Basing on the above results, by using the N-type Si(100)substrate with the thick 400 μm, typical suspended Micro-structures are realized, which is 3 mm×3 mm with the line width 100±2 μm and the depth of the silicon trench 390±2 μm." @default.
- W2389318120 created "2016-06-24" @default.
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- W2389318120 date "2015-01-01" @default.
- W2389318120 modified "2023-09-23" @default.
- W2389318120 title "Processing of the Suspended Micro-structure Based on Bulk Silicon MEMS Technology" @default.
- W2389318120 hasPublicationYear "2015" @default.
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