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- W2389366932 abstract "Solder joining is one of the interconnection methods in microelectronic packaging especially for the ball grid array (BGA) package type. The robustness of solder joint is directly related to solder ball alloy composition. In this paper, SAC405 & SAC387 were compared in terms of the following characteristics: alloy properties, solder ball surface morphology, solder ball shear strength (at time zero, after test, after multiple reflow, after high temperature storage, after moisture sensitivity level 3/260°C), Intermatellic Compound (IMC) thickness and morphology, missing ball after test and solderability. As a result, SAC387 reported better solder joint performance than SAC405 to be used in ball grid array packaging. This is supported by IMC thickness measurement that shows significant different in term of growth and consistency. Solder joint performance decreased with response to the increase number of multiple reflow and storage time." @default.
- W2389366932 created "2016-06-24" @default.
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- W2389366932 date "2007-01-01" @default.
- W2389366932 modified "2023-09-27" @default.
- W2389366932 title "RELIABILITY OF SAC405 AND SAC387 AS LEAD-FREE SOLDER BALL MATERIAL FOR BALL GRID ARRAY PACKAGES" @default.
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