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- W2391353793 abstract "The storage density of disk is influenced directly by surface quality, so the best surface smooth and non surface defects are required for substrate surface. In this paper,the chemical character of NiP substrate of computer disk was analyzed,the CMP mechanism was discussed, action of abrasive in slurry on NiP film CMP was analyzed. It was indicated that the abrasive in slurry not only has the effect of grinding but also acts as micro-stirrer during CMP process. According to the experiments the effect of silica sol size and concentration in alkali slurry on removal rate and roughness of NiP substrate were analyzed and the higher removal rate was obtained. Low roughness was realized with small size and low hardness silica sol as abrasive." @default.
- W2391353793 created "2016-06-24" @default.
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- W2391353793 date "2009-01-01" @default.
- W2391353793 modified "2023-09-26" @default.
- W2391353793 title "Influence of Abrasive on CMP Quality for NiP Substrate of Computer Hard-disk" @default.
- W2391353793 hasPublicationYear "2009" @default.
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